Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors VII

An ECI Conference Series

May 19-23, 2019
Palace Side Hotel
Kyoto, Japan


About This Conference

The 7th ULSIC vs. TFT conference continues the tradition of the previous six successful conferences held in Barga, Italy (2007), Xi’An, China (2009), Hong Kong, China (2011), Grenoble, France (2013), Lake Tahoe, California, USA (2015) and Hernstein, Austria (2017) in providing a forum to discuss the latest developments in semiconductor technology, ranging from nanoscience to giga-scale integration.

This is the only conference bringing together experts from the two most popular semiconductor technologies – ULSICs and TFTs – to discuss ideas and exchange opinions on future challenges cohesively.  Both technologies are based on the same principles and face common challenges in devices, materials, fabrication processes, reliability, and applications.

The goal of this conference is to exchange state-of-the-art information and thoughts among those involved in research and development.  Invited speakers include distinguished researchers, engineers, professors, and national academy members from US, Europe and Asia.  A portion of the oral and poster presentations are reserved for junior researchers.

Technical Co-Sponsors

ECS Electronics and Photonics Division
Korean Physical Society Semiconductor Division
Japan Society of Applied Physics

Technical Program

  • Comparison of ULSIC and TFT science and technology
  • Devices, Physics, Modeling and Reliability
  • Materials of Semiconductors, Dielectrics and Interconnects
  • Advanced Fabrication Processes
  • New and Novel Applications
  • Panel Discussions
  • Poster Presentations

Previous ECI Conference on this topic.

Technical Co-Sponsors

The Korean Physical Society

Conference Organization


Yue Kuo, Texas A&M University


Junichi Murota, Tohoku University
Yukiharu Uraoka, Nara Institute of Science and Technology

Local Chair:        Yasuhiro Fukunaka, Kyoto University

Conference Program

Final Program with Posters

Poster Prize Winners

First Place Poster Winner–

Effect of different a-InGaZnO TFTs channel thickness upon self-heating stress

Ting-Chang Chang, National Sun Yat-sen University; Po-Wen Chang, National United University; Yu-Ching Tsao, National Sun Yat-sen University; Mao-Chou Tai, National Sun Yat-sen University, Taiwan

Chairman Yue Kuo congratulates Po-Wen Chang

Second Place Poster Winner– 

Analysis of IGZO crystalline structure and its stability by first-principles calculations

Tomonori Nakayama, Masahiro Takahashi, Tomosato Kanagawa, Toshimitsu Obonai, Kenichi Okazaki, and Shunpei Yamazaki, Semiconductor Energy Laboratory, Japan

Chairman Yue Kuo congratulates Tomonori Nakayama


19AP Group Excursion Photo 05.21.19

7th ULSIC vs. TFT Group Photo


General Information About ECI

Engineering Conferences International (ECI) is a global engineering conferences program, originally established in 1962, that provides opportunities for the exploration of problems and issues of concern to engineers and scientists from many disciplines.

The format of the weeklong research conference provides morning and late afternoon or evening sessions in which major presentations are made. Available time is included during the afternoons for ad hoc meetings, informal discussions, and/or recreation. This format is designed to enhance rapport among participants and promote dialogue on the development of the meeting. We believe that the conferences have been instrumental in generating ideas and disseminating information to a greater extent than is possible through more conventional forums.

All participants are expected both to attend the entire conference and to contribute actively to the discussions. The recording/photographing of lectures and presentations is forbidden. As ECI conferences take place in an informal atmosphere, casual clothing is the usual attire.

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