Final Program

THERMAL CHALLENGES
IN NEXT GENERATION ELECTRONIC SYSTEMS

January 13 - 17, 2002
Hotel Santa Fe
1501 Paseo de Peralta
Santa Fe, New Mexico 87501
T: 1-505-982-1200 F: 1-505-984-2211

Conference Chairs
Professor Yogendra Joshi
Department of Mechanical Engineering
University of Maryland

Professor Suresh Garimella
School of Mechanical Engineering
Purdue University

UNITED ENGINEERING FOUNDATION, INC.
Three Park Avenue, 27th Floor
New York, NY 10016-5902
T: 1-212-591-7836 - F: 1-212-591-7441
E: engfnd@aol.com - www.engfnd.org/2at.html

Synopsis
As electronic products become faster and incorporate greater functionality, they are also shrinking in size and weight, with continuing pressures for cost reduction. Thermal issues are key in electronic product development at all levels of the electronic product hierarchy, from the chip to the ultimate system. Shrinking system sizes are resulting in increasing volumetric heat generation rates and surface heat fluxes in many products. This has resulted in a significant interest in ultra-compact high heat removal thermal management devices. Additional thermal management challenges arise as more and more electronic systems are employed in harsh environments, subject to large variations in ambient temperatures and external thermal loads. A synergistic activity is thermal characterization through computations. High-fidelity modeling schemes are being sought, as product development cycles shrink to a period of months in many portable products.

This conference will focus on the recent advances in thermal management and characterization schemes, as well as forecasts and analyses of future trends. Invited talks in selected emerging areas from leading experts in industry and academia are complemented with contributed papers. Panel discussions focusing on technology and market trends and identification of research challenges are also featured.

Conference Scientific Committee
M. Baelmans (K.U. Leuven, Belgium)
A. Bar-Cohen (University of Minnesota, USA)
V.P. Carey (Univ. of California, Berkeley, USA)
J. Lohan (Galway-Mayo Institute of Technology, Ireland)
R. Mahajan (University of Colorado,USA)
R. Mahajan (Intel, Chandler, Arizona, USA)
W. Nakayama (Therm Tech., Japan)
C. Patel (Hewlett-Packard Laboratories, USA)
J. Rantala (Nokia Research Center, Finland)
M. Rencz (T.U. Budapest, Hungary)
B. Sammakia (SUNY Binghamton, USA)
K.C. Toh (NTU, Singapore)

The conference organizers would like to acknowledge the generous support of the U.S. National Science Foundation.

Technical Program

Sunday January 13

2:00 - 4:00 pm Registration

3:30 - 4:00 pm Coffee

4:00 - 5:15 pm Panel 1 - Thermal Management Roadmaps
A. Bar-Cohen & R. Mahajan - Moderators

5:15 - 7:00 pm Session 1 - Transport in Thermal Management Materials and Across Interfaces
Chair: Ravi Mahajan

Invited Talk - Temperature measurement of semiconductor devices
D.L. Blackburn, Deputy Director, Semiconductor Electronics Division, NIST

Spreading resistance with convective heat transfer from top and bottom surfaces
K.C. Toh, X.Y. Chen & J.C. Chai

Spreading in the heat sink base: Phase change systems or solid metals?
I. Sauciuc, G. Chrysler, R. Mahajan & R. Prasher

Performance and testing of thermal interface materials
J.P. Gwinn & R.L. Webb

In-plane effective thermal conductivity of plain-weave screen laminates
J. Xu & R.A. Wirtz

7:00 - 9:30 pm Social Hour & Dinner (with Dinner Speaker)
Keynote 1-Thermal Management: Evolution, Status and Challenges
Nasser Grayeli, Director and General Manager, Assembly Technology Development, Intel Corporation, Chandler, Arizona
Chair: B. Courtois

Monday January 14

7:00 - 8:00 am Breakfast

8:00 - 8:45 am Keynote 2 - Technology Innovations for a New Era
Robert M. Dunn, University of Notre Dame, South Bend, Indiana (Formerly, Corporate Vice President of Systems & Platforms and Manufacturing Staff, IBM Corporation)
Chair: Y. Joshi

8:45 - 10:00 am Panel 2-Microscale Cooling Systems - Successes, Barriers and Integration
with Electronic Devices

V. Carey & K.C. Toh - Moderators

10:00 - 10:15 am Coffee Break

10:15 - 11:25 am Session 2-Challenges in Micro and Nano Scale Transport - I
Chair: S. Wereley

Invited Talk - Thermal issues in MEMS and microscale systems
D.L. DeVoe, Department of Mechanical Engineering, University of Maryland, College Park

Anisotropic thermal conductivity of aligned carbon nanotube arrays
T. Borca-Tasciuc, R. Vajtai, B.Q. Wei, P.M. Ajayan, J. Deng, R. Gaska & M.S. Shur

Chip integrated micro cooling system for high heat flux electronic cooling applications
S. Chowdhury, J. Darabi, M. Ohadi & J. Lawler

11:25 - 12:30 am Session 3-Challenges in Micro and Nano Scale Transport - II
Chair: D. DeVoe

Invited Talk - Thermal challenges in MEMS applications: Phase change phenomena and thermal bonding processes
L. Lin, Department of Mechanical Engineering, University of California at Berkeley

Simultaneous, spatially-resolved temperature and velocity measurements in microchannel flows
S.T. Wereley, V. Hohreiter & J. Chung

Nonequilibrium electron and phonon transport and energy conversion in heterostructures
T. Zeng & G. Chen

12:30 - 1:30 pm Lunch

1:30 -2:30 pm (Conference Scientific Committee Meeting)

3:30 - 4:00 pm Afternoon Coffee

4:00 - 5:15 pm Panel 3-Component through System Level Numerical Modeling:
Requirements, Reality and Future?

J. Lohan, M. Baelmans - Moderators

5:15 - 7:30 pm Session 4-Compact Models and System-Level Challenges
Chairs: M. Baelmans and J. Lohan

Invited Talk - Computational techniques for simulation of sub-micron thermal conduction
J.Y. Murthy, School of Mechanical Engineering, Purdue University, and S.R. Mathur, Fluent, Inc.

Creating reduced-order models for electronic systems: An overview and suggested use of existing model reduction and experimental system identification tools
B.Shapiro

The application of a genetic algorithm to develop compact thermal models
R. Clarksean & J. Torkelson

Thermal modelling and experimental evaluation of outdoor cabinets
K. Nevelsteen, M. Baelmans, W. Nelemans, G. Swaelen & R. De Smedt

Advanced thermal architecture for cooling of high power electronics
Z.J. Zuo, L.R. Hoover & A.L. Phillips

Remote heat sink concepts for high power heat rejection
R.L. Webb & S. Yamauchi

7:30 - 8:30 pm Social Hour

8:30 pm Dinner on your own

Tuesday January 15

7:00 - 8:00 am Breakfast

8:00 - 8:45 am Keynote 3-Towards planetary scale computing - Technical challenges for next generation Internet computing
Rich Friedrich, Director, and Chandrakant Patel, Principal Scientist, Internet Systems and Storage Laboratory, Hewlett Packard Laboratories, Palo Alto, California
Chair: S.V. Garimella

8:45 - 10:00 am Panel 4-The Hardware Needs of Future High Performance & Internet Computing Workloads and the Implications on Cooling and Physical Design
C. Patel & A. Ortega - Moderators

10:00 - 10:15 am Coffee Break

10:15 - 12:30 pm Sessions 5 -Advanced Design Methodologies
Chair: G. Kojasoy

Invited Talk - Design and optimisation of air-cooled heat sinks for sustainable development
A. Bar-Cohen and M. Iyengar, Center for the Development of Technological Leadership, University of Minnesota

High-density server design methodology
D.S. De Lorenzo

Evaluation of 1-D & 2-D models for thermal insulation thickness calculation in electronic packaging
S. Moghaddam, M. Rada, A. Shooshtari, M. Ohadi & Y. Joshi

A flexible approach to cooling system design
C.M. Hagg, H. Bucsich, M. Harrer, A. Loidl, T. Raeva, A.H. Whitehead & M. Schreiber

Session 6-High Heat Flux Transport Challenges
Chair: M. Ohadi

Pool boiling experiments for HFE-7100 dielectric liquid
M.S. El-Genk & H. Bostanci

Single-phase and flow boiling cooling in multiple miniature curvilinear channels
R.S. Downing & G. Kojasoy

Microscale heat transfer to pressurized water at ultra-high power density
R.H. Leyse

12:30 - 1:30 pm Lunch

3:30 - 4:00 pm Afternoon Coffee

Tuesday January 15

4:00 - 5:30 pm Session 7-Novel Thermal Management Concepts - I
Chair: G. Mitic

Invited Talk - Thermoelectric Microcoolers for Thermal Management Applications
J.-P. Fleurial, Materials & Device Technologies Group Supervisor, Jet Propulsion Laboratory

Vibration-induced droplet atomisation heat transfer cell for high-heat flux dissipation
S.N. Heffington, W.Z. Black & A. Glezer

Dynamics and topology optimisation of piezoelectric fans
P. Bürmann, A. Raman & S.V. Garimella

Transient and sub-atmospheric performance of a closed-loop electroosmotic microchannel cooling system
L. Jiang, J. Mikkelsen, J-M. Koo, L. Zhang, D. Huber, S. Yao, A. Bari, P. Zhou, J. Santiago, T. Kenny, K.E. Goodson, J. Maveety, R. Prasher & S. Benning

5:30 - 7:30 pm Session 8 - Novel Thermal Management Concepts - II
Chair: R. Wirtz

Invited Talk - Thin Film Solid State Refrigerators for Spot Cooling of Integrated Circuits
A. Shakouri, Jack Baskin School of Engineering, University of California at Santa Cruz

Dynamics of a liquid plug in a capillary powered by vapor explosion
O. Suzuki, Y.K. Joshi & W. Nakayama

A novel SOI CMOS compatible thermal device technology
T. McNutt, A. Lostetter, A. Mantooth & M. Mojarradi

Spray cooling of IGBT electronic power modules
G. Mitic, W. Kiffe, G. Lefranc, S. Ramminger, D.E. Tilton, B.A. Smetana & T.D. Weir

Application of thermoacoustic engines to heat transfer in microcircuits
O.G. Symko, E. Abdel-Rahman, Y.S. Kwon, M. Emmi & R. Behunin

Action of low and high gravity levels on cryogenic cooling with boiling of electronics
V.F. Prisniakov & K.V. Prisniakov

8:00 - 10:00 pm Banquet

Wednesday January 16

7:00 - 8:00 am Breakfast

8:00 -8:45 am Invited Talk - Hot topics for cool devices - Thermal challenges for a small planet
J. Rantala, Manager, Nokia Research Center

8:45 - 10:00 am Panel 5-Thermal Issues in Manufacturing
R. Mahajan & B. Sammakia - Moderators

10:00 - 10:30 am Coffee Break

10:30 - 12:00 noon Session 9-Heat Pipes and Thermosyphons
Chair: J. Zuo

Metal foam heat sinks for laptop cooling application in a heat pipe-heat sink arrangement
A. Gupta & N.F. Dean

Design and performance evaluation of a compact thermosyphon
A. Pal, Y. Joshi, M.H. Beitelmal, C.D. Patel & T. Wenger

Innovative wick design for multi-source, flat plate heat pipes
M.J. Rightley, C.P. Tigges, R.C. Givler, C.V. Robino, J.J. Mulhall & P.M. Smith

Vibration actions on heat pipes as cooling element of electronic systems
K.V. Prisniakov, Yu.E. Nikolaenko & V.F. Prisniakov

12:00 - 1:00 pm Lunch

1:00 - 3:00 pm Session 10-Analysis and Testing Methods
Chair: M. Rightley

Invited Talk - New possibilities in the thermal evaluation, offered by transient testing
M. Rencz, MicReD, Hungary

Integrated simulation toolkit for electronic controlled motor system
Y. Liu, J.H. Lienhard V, J.D. Booth & R.W. Stairs

Transient performance of multi-stack cold plates
S.L. Beh, G.A. Quadir, K.N. Seetharamu & A.Y. Hassan

A study of temperature field in a GaN Heterostructure Field-Effect Transistor
M.A. Baig, M.Z. Khandkar, J.A. Khan, M.A. Khan, G. Simin & H. Wang

Finite elements or finite volumes: Which to choose for airborne electronic packaging thermal analysis
F. Wang

3:00 pm Conference Adjournment

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